Vacuum Coating
Thermal Evaporation Equipment
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Use

Typical Applications

Thick film evaporation of In, Sn, AuSn.

Principle

The material is heated to a high temperature by resistive heating to evaporate it. The evaporated material molecules move toward the substrate in a vacuum and deposit on the substrate surface to form a thin film.

Support

The maximum thickness of a single pass is no more than 10μm

Technical Indicators

  • Size

    8-inch sample, downward size compatible;

  • Working vacuum

    Background vacuum 5E-4Pa;

  • In deposition thickness

    Single process 1-10um;

  • Typical process

    Evacuate for about 1 hour to a vacuum of 5E-4Pa, evaporate 10gIn for about 5 minutes at a current of 300A, and evaporate a film of about 8-10μm thickness. After cooling for 15 minutes, inflate the chamber and take samples. Evacuate for about 1 hour to a vacuum of 5E-4Pa, evaporate 10gSn for about 10 minutes at a current of 350A, and evaporate a film of about 6μm thickness. After cooling for 15 minutes, inflate the chamber and take samples.

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