It is used to evaporate common metals such as Ti, Al, Ni, Cr and precious metals such as Pt and Au. The maximum evaporation thickness of some metals can reach 1000nm.
Principle
In a high vacuum environment, the electron gun filament is heated and emits thermal electrons. The thermal electrons are accelerated by the electric field and gain great kinetic energy. Under the constraint of permanent magnets or electromagnets, they are deflected to the surface of the evaporation source, bombarding the material and vaporizing it, thereby achieving the purpose of evaporation.
Support
2, 4, 6, 8 inch wafers. Up to 74 2-inch wafers, 24 4-inch wafers, 8 6-inch wafers, and 4 8-inch wafers can be evaporated at one time. The sample size is downward compatible, and the film non-uniformity is ≤±3%.
Technical Indicators
Power
Evaporation rate 0.01nm/s-2nm/s, pre-evaporation power 10%-45%, evaporation power 0-60%;