Can be used to spin-coat photoresist on lithography samples.
Principle
Various glue solutions are dripped onto the substrate rotating at high speed, and the glue solution dripped onto the substrate is evenly coated on the substrate by centrifugal force. The thickness of the film depends on the speed of the glue machine and the viscosity of the sol.
Support
This device supports samples with a minimum size of 1cm*1cm and a maximum size of 8 inches.
Technical Indicators
Sample size
1cm-20cm；
Speed range
0-6000 rpm;
Non-uniformity of coating
≤0.5%. Equipped with a heating table with a maximum temperature of 300℃.
15050455470 
