Used for evaporation of common metals such as Ti, Al, Ni, Cr and precious metals such as Pt and Au. The maximum evaporation thickness of some metals can reach 1000nm
Principle
Under high vacuum environment, after the electron gun filament is heated, it emits hot electrons. The hot electrons are accelerated by the electric field and gain great kinetic energy. Under the constraint of permanent magnets or electromagnets, they are deflected to the surface of the evaporation source, bombarding the material and vaporizing it, thus achieving the purpose of evaporation.
support
Supports 2, 4, 6, and 8-inch wafers. Up to 74 2-inch wafers, 24 4-inch wafers, 8 6-inch wafers, and 4 8-inch wafers can be evaporated at one time. The sample size is backward compatible, and the film non-uniformity is ≤±3%
Technical Indicators
Evaporation rate
Evaporation rate 0.01nm/s-2nm/s, pre-evaporation power 10%-45%, evaporation power 0-60%
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